| FEATURE |
•High density packaging with a pitch of 2.54mm (0.1 inch) max. is possible. This series requires less space and has greater EMI suppression effects. •Different types with the same shape are available. •Excellent in physical properties, such as terminal strength, flexure strength, soldering resistance and solderability. •Applicable to both flow and reflow soldering. •High impedance cover wide frequency ranges. •L material type can minimize attenuation of the signal waveform due to its sharp impedance characteristics. |
